- Microchip encapsulation molding overview.
- Modeling wires for microchip encapsulation.
- Modeling paddles for microchip encapsulation.
- Model assembly for microchip encapsulation.
- Analysis setup for microchip encapsulation.
- Compression molding with wire sweep.
- Results interpretation of microchip encapsulation analyses.
Prerequisites
This training manual assumes knowledge of Autodesk Simulation Moldflow Insight, including CAD Model importing, and meshing. Refer to the manual Autodesk Simulation Moldflow Insight Fundamentals for more information on these subjects.
AutoCAD Training Course Duration
8 hours
AutoCAD Training Course outline
Chapter 1 Microchip Encapsulation Molding Overview
Chapter 2 Simulating Microchip Encapsulation Molding
Chapter 3 Modeling Wires for Microchip Encapsulation Analysis
Chapter 4 Modeling Paddles for Microchip Encapsulation Analysis
Chapter 5 Model Assembly for Microchip Encapsulation Analysis
Chapter 6 Analysis Setup for Microchip Encapsulation Projects
Chapter 7 Results Interpretation of Microchip Encapsulation Analysis
Chapter 8 Compression Molding with Wire Sweep
Appendix A Glossary
