Autodesk Simulation Moldflow Insight 2015 Underfill Encapsulation
AutoCAD Training Overview
The Underfill Encapsulation with Autodesk Simulation Moldflow Insight 2015 training material discusses the underfill encapsulation process used in the electronics industry. Discussions include an overview of the underfill encapsulation process and material, and simulating underfill.
This training manual assumes knowledge of Autodesk Simulation Moldflow Insight, including CAD Model importing, and meshing. Refer to the guide Autodesk Simulation Moldflow Insight Fundamentals for more information on these subjects.
AutoCAD Training Topics
Prerequisites
AutoCAD Training Course Duration
6 hours
AutoCAD Training Course outline
Chapter 1 Underfill Encapsulation Molding Overview
Chapter 2 Simulating Underfill Encapsulation Molding
Chapter 3 Underfill Encapsulation Material
Chapter 4 Underfill Encapsulation Practice
Appendix A Glossary
Appendix B Calculation of Shape Factor in Flip Chip Analysis
